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windows_ic

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ball grid array
ball grid array
Specification: SOP
Detail: N/A

2
tqfp
tqfp
Specification: 100L
Detail: This package change has not only helped to reduce the package size significantly, but also lowered the thermal resistance from 28ˇăC/W to 25ˇăC/W. However, the die orientation within the package has now changed from 'cavity-do...
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